Job description:
Role Summary:We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. Youll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.
Key Responsibilities:
- Perform package substrate design and analysis (SI/PI/routing)
- Collaborate with layout engineers, marketing, and global design teams
- Use tools like HFSS, ADS for package modeling/simulation
- Contribute during pre/post-sales processes
Qualifications:
Qualifications:
- BS in EE or related field; MS preferred
- 810 years of experience in semiconductor package design
- Strong SI/PI analysis, modeling, and simulation skills
- Excellent communication, teamwork, and presentation abilities
Preferred Skills:
- Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet)
- Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysis
- Experience with Hspice, Redhawk, electro-thermal simulation, PDN modeling
- Familiarity with reliability analysis and packaging/assembly rules
Why is This a Great Opportunity:
outstanding technology, great opportuity to learn. Growing company with a lot of IP. Everyone contributes.
Salary Type : Annual Salary
Salary Min : $ 190000
Salary Max : $ 220000
Currency Type : USD